PACK Challenge Participants

In July, Rich Township started its journey in the PACK Challenge.  The PACK Challenge is a real-world, end-to-end competition at PACK EXPO International that requires collaboration, creativity, conception, process, design, build, programming, debug, marketing and field installation knowledge – all put to the test in a competition format!

Six local Chicago schools received pre-crated kits that contain components necessary to build a machine that fills the specified product into the provided container in a mock production line. They designed, built, and programmed a filling machine. The machine fills small and large bottles with marbles in an average of 8 seconds a bottle.

At the onsite PACK Challenge competition during PACK EXPO International from October 24th through October 26th, Rich Township students were required to build their filling machines on-site and conduct multiple presentations as part of the competition.

Teams were judged in a variety of areas, including design, operator training, changeover and sales/marketing.

At the conclusion of the event, Rich Township High School walked away with 3rd place for Best in Show and 2nd Place for Filling Performance. The students also met colleges and companies that want to bring them on as interns as well as attend their universities. “Mrs. Freelain and I are very proud of the work they have done and look forward to participating in this event in the future,” said Mike Wilson, technology and engineering teacher and Manufacturing, Robotics, and Engineering (MER) sponsor.