PACK Challenge

On Tuesday, July 12th, Rich Township High School began its journey in the PACK Challenge. 

The PACK Challenge is a real-world, end-to-end competition at PACK EXPO International that requires collaboration, creativity, conception, process, design, build, programming, debug, marketing and field installation knowledge – all put to the test in a competition format!

Students from the PLTW program and metal working will be the primary participants, but the challenge is open to any students interested in presentation, documentation, and marketing, says Applied Tech teacher Mike Wilson. “It’s about solving a problem for a customer and dealing with all aspects of a company’s process.”


Six local Chicagoland schools will receive pre-crated kits that contain components necessary to build a machine that fills the specified product into the provided container in a mock production line. These teams will have through October 2022 to design and build their machine, which will then be crated and shipped to PACK EXPO International.


At the onsite PACK Challenge competition during PACK EXPO International, students will be required to build their filling machines on-site and conduct multiple presentations as part of the competition.


Teams will be judged in a variety of areas, including design, operator training, changeover and sales/marketing.